Temperature-Dependent Characterization of AlGaN/GaN HEMTs: Thermal and Source/Drain Resistances

This paper shows the application of simple dc techniques to the temperature-dependent characterization of AlGaN/ GaN HEMTs in terms of the following: 1) thermal resistance and 2) ohmic series resistance (at low drain bias). Despite their simplicity, these measurement techniques are shown to give valuable information about the device behavior over a wide range of ambient/channel temperatures. The experimental results are validated by comparison with independent measurements and numerical simulations.

[1]  Jasprit Singh,et al.  Transient study of self-heating effects in AlGaN/GaN HFETs: Consequence of carrier velocities, temperature, and device performance , 2007 .

[2]  G. Umana-Membreno,et al.  Magnetotransport in AlGaN/GaN and AlGaN/AlN/GaN heterostructures , 2007 .

[3]  J. Teyssier,et al.  Transient self-heating effects in multifinger AlGaN/GaN HEMTs with metal airbridges , 2007 .

[4]  G. Simin,et al.  Compact Model of Current Collapse in Heterostructure Field-Effect Transistors , 2007, IEEE Electron Device Letters.

[5]  S. Russo,et al.  Influence of the Source–Gate Distance on the AlGaN/GaN HEMT Performance , 2007, IEEE Transactions on Electron Devices.

[6]  S. Cassette,et al.  SThM Temperature Mapping and Nonlinear Thermal Resistance Evolution With Bias on AlGaN/GaN HEMT Devices , 2007, IEEE Transactions on Electron Devices.

[7]  G. Simin,et al.  Selectively Doped High-Power AlGaN/InGaN/GaN MOS-DHFET , 2007, IEEE Electron Device Letters.

[8]  M. Kuball,et al.  Time-Resolved Temperature Measurement of AlGaN/GaN Electronic Devices Using Micro-Raman Spectroscopy , 2007, IEEE Electron Device Letters.

[9]  G. Simin,et al.  RF-Enhanced Contacts to Wide-Bandgap Devices , 2007, IEEE Electron Device Letters.

[10]  J. Berg,et al.  Self-heating in a GaN based heterostructure field effect transistor: , 2006 .

[11]  C. Bolognesi,et al.  At-Bias Extraction of Access Parasitic Resistances in AlGaN/GaN HEMTs: Impact on Device Linearity and Channel Electron Velocity , 2006, IEEE Transactions on Electron Devices.

[12]  M. Germain,et al.  Improved Thermal Performance of AlGaN/GaN HEMTs by an Optimized Flip-Chip Design , 2006, IEEE Transactions on Electron Devices.

[13]  Nidhi,et al.  Study of Impact of Access Resistance on High-Frequency Performance of AlGaN/GaN HEMTs by Measurements at Low Temperatures , 2006, IEEE Electron Device Letters.

[14]  Hangfeng Ji,et al.  Integrated micro-Raman/infrared thermography probe for monitoring of self-heating in AlGaN/GaN transistor structures , 2006, IEEE Transactions on Electron Devices.

[15]  G. Borghs,et al.  Three-dimensional thermal analysis of a flip-chip mounted AlGaN/GaN HFET using confocal micro-Raman spectroscopy , 2006, IEEE Transactions on Electron Devices.

[16]  R. Vetury,et al.  Nonlinear source resistance in high-voltage microwave AlGaN/GaN HFETs , 2006, IEEE Transactions on Microwave Theory and Techniques.

[17]  B. S. Kang,et al.  Effective temperature measurements of AlGaN/GaN-based HEMT under various load lines using micro-raman technique , 2006 .

[18]  P. Romanini,et al.  Experimental validation of GaN HEMTs thermal management by using photocurrent measurements , 2006, IEEE Transactions on Electron Devices.

[19]  S. Delage,et al.  Output power density of 5.1/mm at 18 GHz with an AlGaN/GaN HEMT on Si substrate , 2006, IEEE Electron Device Letters.

[20]  R. Menozzi,et al.  A new technique to measure the thermal resistance of LDMOS transistors , 2005, IEEE Transactions on Device and Materials Reliability.

[21]  S. Keller,et al.  Influence of the dynamic access resistance in the g/sub m/ and f/sub T/ linearity of AlGaN/GaN HEMTs , 2005, IEEE Transactions on Electron Devices.

[22]  W. Doolittle,et al.  Heat dissipation in high-power GaN electronics on thermally resistive substrates , 2005, IEEE Transactions on Electron Devices.

[23]  E. Kohn,et al.  Transient thermal characterization of AlGaN/GaN HEMTs grown on silicon , 2005, IEEE Transactions on Electron Devices.

[24]  Y. Hirose,et al.  Source resistance reduction of AlGaN-GaN HFETs with novel superlattice cap layer , 2005, IEEE Transactions on Electron Devices.

[25]  Colombo R. Bolognesi,et al.  Effect of gate-source access region stress on current collapse in AlGaN/GaN HFETs , 2005 .

[26]  C.C. Lee,et al.  Thermal modeling and measurement of AlGaN-GaN HFETs built on sapphire and SiC substrates , 2004, IEEE Transactions on Electron Devices.

[27]  C. H. Oxley Method for measuring source resistance Rs in saturation region of GaN HEMT device over bias conditions (Vgs,Vds) , 2004 .

[28]  Umesh K. Mishra,et al.  12 W/mm power density AlGaN/GaN HEMTs on sapphire substrate , 2004 .

[29]  E. Kohn,et al.  Transient characteristics of GaN-based heterostructure field-effect transistors , 2003 .

[30]  Martin Kuball,et al.  Measurement of temperature distribution in multifinger AlGaN/GaN heterostructure field-effect transistors using micro-Raman spectroscopy , 2003 .

[31]  J. Kuzmík,et al.  Determination of channel temperature in AlGaN/GaN HEMTs grown on sapphire and silicon substrates using DC characterization method , 2002 .

[32]  Seungmin Lee,et al.  Thermal conductivity of κ-Al2O3 and α-Al2O3 wear-resistant coatings , 1998 .

[33]  M. Shur,et al.  Self-heating in high-power AlGaN-GaN HFETs , 1998, IEEE Electron Device Letters.

[34]  Y. Zhu,et al.  Direct determination of source, drain and channel resistances of HEMTs , 1995 .

[35]  Keiichi Yamamoto,et al.  Raman microprobe study on temperature distribution during cw laser heating of silicon on sapphire , 1986 .

[36]  L. Yang,et al.  New method to measure the source and drain resistance of the GaAs MESFET , 1986, IEEE Electron Device Letters.

[37]  H. Fukui,et al.  Determination of the basic device parameters of a GaAs MESFET , 1979, The Bell System Technical Journal.