Cylindrical Conduction Mode Basis Functions for Modeling of Inductive Couplings in System-in-Package (SiP)

PEEC method with global basis functions on the cylindrical coordinates is presented for efficient modeling of bond wires in system-in-package. Combination of a few basis functions accurately describes high-frequency effects of closely located wires with shorter simulation time compared to the conventional PEEC method. Simplified equivalent circuit from the proposed method is also favorable for modeling of large coupling structures.

[1]  Herbert Reichl,et al.  Closed‐form network representations of frequency‐dependent RLGC parameters , 2005, Int. J. Circuit Theory Appl..

[2]  L. Daniel,et al.  Interconnect electromagnetic modeling using conduction modes as global basis functions , 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

[3]  Frederick Warren Grover,et al.  Inductance Calculations: Working Formulas and Tables , 1981 .