An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling
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Léa Di Cioccio | Pierric Gueguen | Rachid Taibi | Thomas Signamarcheix | Laurent Bally | Laurent Vandroux | Marc Zussy | Sophie Verrun | Jérôme Dechamp | Patrick Leduc | Myriam Assous | David Bouchu | François de Crecy | Laurent-Luc Chapelon | Laurent Clavelier