Compact modeling approach using genetic algorithms for accurate thermal simulation

We propose a technique that uses thermal measurement results for improved accuracy in thermal simulation of electronic apparatus. Because the modeling of the electronic components in such apparatus has hitherto been very poor, the thermal simulation results cannot achieve the required accuracy. To solve this problem, we first represent a component as a set of cubic blocks with equivalent thermal conductivity and contact thermal resistance values, and then identify these values by using the thermal measurement results for the component. We regard the identification of parameters as an optimization problem that involves minimizing the difference between the predicted and measured results. To solve the problem, we combine genetic algorithms and a thermal simulation tool