Dwcription: The term system-on-sficon has been used to denote the integration of random logic, processor cores, SRAMS, ROMs, and analog components on the same die. But up to recently, one major component had been missing: high-density DRAMs. Today’s technologies allow the integration of sigtilcant amounts of DW memory for applications such as data buffetig, picture storage, and progrtidata storage. h quarter-micron technology, chips with up to 128 Mbit of DRAM and 500 kgates of logic are eminently feasible. This enlarges the system design space tremendously since system architects are no more restricted to standard commodity DRAMs. We will discuss the market for embedded DRAM applications as well as the associated challenges. Next, the system design requirements from different apphcation domains WMbe anrdyzed in session two. The first part wH1focus on a 32-bit NSC processor with embedded DRAM in tie video processing context. It w~ include the processor micro architecture and organization rdong with some data on the process technology and design methodology. k a second part, harddisc-drive @D) contro~ers are addressed, which are a very typicrd application for an embedded DRAM solution. We wi~ high~ght design issues related to such systems on siticon (design flow, required views, W/SW-codesign, testing aspects). k part three, opportunities, ch~enges and trends in general-purpose processor architectures for embedded memory systems wi~ be discussed. The focus wi~ be on the recent architectural trends in highperformance microprocessor, including vector, VL~ and reconfigurable architectures, and the H project. We wi~ describe the strengths and disadvantages of each approach in terms of application performance, scdabtiity and design complexity.