Micromirror arrays fabricated by flip-chip assembly

This paper presents the design, fabrication, modeling, and testing of several Flexure-Beam Micromirror Device (FBMD) arrays fabricated using flip-chip assembly. These arrays were prefabricated using a silicon surface-micromachining technology and then transferred to a ceramic receiving substrate using a thin layer of indium placed between the bond pads of the two chips. Device characterization was completed using an interferometric microscope in which micromirror deflection was determined as a function of address potential. The arrays demonstrate reasonable micromirror performance with optically flat surfaces measuring only 5 - 6 nm of variance across as much as a 150 micrometer mirror surface.