Heterogeneous integration - packaging on and in organic substrates

Decreasing the bill of materials for an electronic device saves development time, money and space. The integration of more and more functions not only on the chip (SoC; system on chip) but also in the package (SiP; system in package) is therefore a natural and very important step in the devolvement of micro electronics. Realizing the goal of Ambient Intelligence requires low cost system solutions where all necessary components are integrated. The future will be a combination of “System on Chip”- and “System in Package” solution called as “Heterogeneous Integration”. As far as technical and economical feasible “System on Chip” solutions will be chosen, the adoption to various applications and the integration of highly complex systems containing non-electronic functions will be carried out more cost efficiently, with a high degree of miniaturization and flexibility in “Heterogeneous Integration”. “Heterogeneous Integration” integrates several chips or components in one package (system in package or SiP) and...