Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs
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Göran Stemme | Niclas Roxhed | Fredrik Forsberg | Frank Niklaus | Martin Lapisa | Adit Decharat | Fabian Zimmer | N. Roxhed | G. Stemme | F. Niklaus | F. Forsberg | M. Lapisa | F. Zimmer | A. Decharat | Michael Populin | Jörn Lemm | J. Lemm | M. Populin
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