Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards
暂无分享,去创建一个
[1] S. B. Cohn,et al. Slot Line on a Dielectric Substrate , 1969 .
[2] B. Shuppert,et al. Microstrip/slotline transitions: modeling and experimental investigation , 1988 .
[3] J. D. Gavenda,et al. A strip-line TEM cell for measuring electromagnetic emissions , 1991, IEEE 1991 International Symposium on Electromagnetic Compatibility.
[4] H. Merkelo,et al. Signal integrity issues at split ground and power planes , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.
[5] Gerardo Aguirre,et al. Methods to reduce radiation from split ground plane structures [packaging] , 1999, IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412).
[6] Jun Fan,et al. RF isolation using power islands in DC power bus design , 1999, 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261).
[7] Y. Ko,et al. Electromagnetic radiation properties of a printed circuit board with a slot in the ground plane , 1999, 1999 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.99EX147).
[8] B. J. Rubin,et al. Distributed effects of a gap in power/ground planes , 1999, IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412).
[9] Nanju Na,et al. Modeling and transient simulation of planes in electronic packages , 2000 .
[10] Joungho Kim,et al. Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board , 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).
[11] Franco Fiori,et al. Measurement of integrated circuit conducted emissions by using a transverse electromagnetic mode (TEM) cell , 2001 .
[12] J. R. Miller. The impact of split power planes on package performance , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[13] Woonghwan Ryu,et al. Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection , 2001 .
[14] Joungho Kim,et al. Microwave frequency crosstalk model of redistribution line patterns on wafer level package , 2001 .
[15] Junho Lee,et al. Slot Transmission Line Model of Interconnections Crossing Split Power/Ground Plane on High-speed Multi-layer Board , 2002, Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects.
[16] Joungho Kim,et al. Tapered slot shape on slotted reference plane of multi-layer PCB for reduction of crosstalk and radiated emission , 2002, Electrical Performance of Electronic Packaging,.