Electromagnetic interference simulations of power electronic modules

At higher frequencies, EMI emissions of a power electronic module largely depend on the layout and area of the current conduction paths. In this paper, EMI simulations are compared between a coplanar module and a three-dimensional (3D) module. The EMI simulations were performed using 3D EM simulation software. The EMI emission, in terms of DC-bus bar capacitances, of a balanced and unbalanced power electronic module is investigated. It is concluded that a three-dimensional multilayer approach is more suitable for addressing the issue, both in terms of reducing parasitic inductance and minimizing EMI effects. Also, care should be taken to design balanced bus bars to minimize EMI noise.