论文信息 - ISFET CMOS compatible design and encapsulation challenges

ISFET CMOS compatible design and encapsulation challenges

This work presents the main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.

Yael Nemirovsky | Uri Dinnar | Arkadiy Morgenshtein | Liby Sudakov-Boreysha

[1] P. Bergveld,et al. Analytical and Biomedical Applications of Ion-Selective Field-Effect Transistors , 1988 .

[2] M. Shaw,et al. Improving the process capability of SU-8 , 2003 .

[3] P. Neužil. ISFET integrated sensor technology , 1995 .

[4] W. Hoffmann,et al. Encapsulation of chemically sensitive field-effect transistors with photocurable epoxy resins , 1990 .