An FEM Study of the Electrothermal Properties of Microelectrical Contacts for Application in the Design of Arcless Switches
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[1] B.C.孔菲尔,et al. Electrical distribution system including micro electro-mechanical switch (MEMS) devices , 2012 .
[2] M. Atalla. Arcing of electrical contacts in telephone switching systems , 1955 .
[3] Xing-Ming Long,et al. Numerical Simulation on Electrical-Thermal Properties of Gallium-Nitride-Based Light-Emitting Diodes Embedded in Board , 2012 .
[5] N. C. Tien,et al. Electrical breakdown across micron scale gaps in MEMS structures , 2006, SPIE MOEMS-MEMS.
[6] Yingsan Geng,et al. Decay Modes of Anode Surface Temperature After Current Zero in Vacuum Arcs-Part I: Experimental Study , 2014, IEEE Transactions on Plasma Science.
[7] Anita Agrawal,et al. Investigation of Microelectromechanical Switches for Next Generation DC Power Distribution System , 2014 .
[8] Guifu Ding,et al. Design, Simulation, and Characterization of a Low-Cost In-Plane Spark Gap Microswitch With Dual-Trigger Electrode for Pulsed Power Applications , 2013, IEEE Transactions on Industrial Electronics.
[9] D. Elata,et al. FRINGING FIELD EFFECT IN ELECTROSTATIC ACTUATORS , 2004 .
[10] T. Liu,et al. Characterization of Contact Resistance Stability in MEM Relays With Tungsten Electrodes , 2012, Journal of Microelectromechanical Systems.
[11] 쿰퍼 브렌트찰스,et al. Power switching system including a micro-electromechanical system(mems) array , 2012 .
[12] J. McBride,et al. A review of micro-contact physics for microelectromechanical systems (MEMS) metal contact switches , 2013 .
[13] R. Holm. Electric contacts; theory and application , 1967 .
[14] Paul G. Slade,et al. Electrical contacts : principles and applications , 1999 .
[15] Nan Jing,et al. Analysis of electrical contact temperature rise in spark gap switches with graphite electrodes , 2011, IEEE Transactions on Dielectrics and Electrical Insulation.
[16] G. R. Nagabhushana,et al. Anode hotspot temperature estimation in vacuum gaps under 50 Hz alternating excitations , 1993 .
[17] Qun Ma,et al. Controllable synthesis of hierarchical flower-like ZnO nanostructures assembled by nanosheets and its optical properties , 2015 .
[18] Effect of electric field on electrical breakdown arc behavior of micro contact gaps: A 3D approach , 2014, 2014 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC).
[19] S. Y. Hwang,et al. Experiments and thermal-electrical analysis of buss bar and relay assemblies in junction blocks , 2013 .
[20] Zheng You,et al. Electrostatically actuated MEMS relay arrays for high-power applications , 2016 .
[21] Gabriel M. Rebeiz,et al. The Search for a Reliable MEMS Switch , 2013, IEEE Microwave Magazine.
[22] Liu Hongtao,et al. Numerical Calculation of Transient Thermal Characteristics in Gas-Insulated Transmission Lines , 2013 .
[23] Elad Alon,et al. Demonstration of Integrated Micro-Electro-Mechanical Relay Circuits for VLSI Applications , 2011, IEEE Journal of Solid-State Circuits.
[24] Min-Wu Kim,et al. An Electrostatically Actuated Stacked-Electrode MEMS Relay With a Levering and Torsional Spring for Power Applications , 2012, Journal of Microelectromechanical Systems.
[25] Paul G. Slade,et al. Electrical Contacts: Principles and Applications, Second Edition , 2014 .
[26] ウィリアム・ジェイムズ・プレマーラニ,et al. Micro-electromechanical system based switching modules stackable in series between the different modules so as to satisfy the voltage rating , 2007 .
[27] J. B. Kim,et al. Coupled finite-element-analytic technique for prediction of temperature rise in power apparatus , 2002 .
[28] J. Aronstein,et al. AC and DC electromigration failure of aluminum contact junctions , 2005, IEEE Transactions on Components and Packaging Technologies.
[29] L. Rosenhead. Conduction of Heat in Solids , 1947, Nature.
[30] J. Oberhammer,et al. Low-voltage high-isolation DC-to-RF MEMS switch based on an S-shaped film actuator , 2004, IEEE Transactions on Electron Devices.
[31] Peter G. Steeneken,et al. Performance limits of MEMS switches for power electronics , 2012, 2012 24th International Symposium on Power Semiconductor Devices and ICs.
[32] M. Bachman,et al. High-Power Magnetically Actuated Microswitches Fabricated in Laminates , 2012, IEEE Electron Device Letters.
[33] K. Takahata,et al. Biocompatible circuit-breaker chip for thermal management of biomedical microsystems , 2015 .
[34] C. Keimel,et al. Microelectromechanical-Systems-Based Switches for Power Applications , 2012, IEEE Transactions on Industry Applications.