Design of orientation stages for step and flash imprint lithography

This paper presents the design of orientation stages for high-resolution imprint lithography machines. These machines implement a new lithography process known as Step and Flash Imprint Lithography (SFIL) and are intended for 1) sub 100 nm imprint demonstrations on flat substrates and 2) investigation of potential defect propagation during step and repeat imprinting. SFIL is an imprint lithography process that is a combination of chemical and mechanical steps and its implementation at room temperature and low pressure makes it an attractive process as compared to other imprint techniques. A critical component of an imprint machine is the orientation stage that is required to provide uniform intimate contact between the template and substrate surfaces. The orientation stage requirements are distinct from those used in photolithography since the depth of focus of projection optics allows for larger errors in the orientation alignment. Also, due to contact between the template and substrate surfaces in imprint lithography, the separation kinematics must be carefully controlled in the SFIL process. Two different orientation stages are designed for single- and multi-imprint machines. In order to eliminate the particle contamination due to frictional contacts, all joints are made with flexure joints. Imprint experiments have been performed to demonstrate sub 100 nm imprints.