Embedded bus switches on 3D data bus for critical access time reduction
暂无分享,去创建一个
[1] Tae Won Cho,et al. Analysis of system bus on SoC platform using TSV interconnection , 2012, 2012 4th Asia Symposium on Quality Electronic Design (ASQED).
[2] R. Tummala,et al. Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[3] Sudeep Pasricha,et al. 3D-Wiz: A novel high bandwidth, optically interfaced 3D DRAM architecture with reduced random access time , 2014, 2014 IEEE 32nd International Conference on Computer Design (ICCD).
[4] Chia-Chun Tsai. Minimizing Critical Access Time for 3D Data Bus Based on Inserted Bus Switches and Repeaters , 2017, 2017 IEEE Computer Society Annual Symposium on VLSI (ISVLSI).
[5] Masoud Daneshtalab,et al. HIBS — Novel inter-layer bus structure for stacked architectures , 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.