论文信息 - Structural Design and Optimization of 65nm Cu/low-k Flipchip Package - 字舞流文

Structural Design and Optimization of 65nm Cu/low-k Flipchip Package

Juan Boon Tan | K. C. Chan | Xiaowu Zhang | V. Kripesh | D. Sohn | A. Tay | Y. K. Lim | L. Hsia | J. Ong | D. Yeo