Determination of the melting and solidification characteristics of solders using differential scanning calorimetry
暂无分享,去创建一个
[1] H. Exner,et al. Numerical modelling of dendritic solidification in aluminium-rich AlCuMg alloys , 1990 .
[2] Sinn-wen Chen,et al. Solidification curves of AlCu, AlMg and AlCuMg alloys , 1996 .
[3] D. R. Frear,et al. The mechanical behavior of interconnect materials for electronic packaging , 1996 .
[4] B. Cantor. Differential scanning calorimetry and the advanced solidification processing of metals and alloys , 1994 .
[5] M. Mccormack,et al. A lower-melting-point solder alloy for surface mounts , 1996 .
[6] Paul T. Vianco,et al. Issues in the replacement of lead-bearing solders , 1993 .
[7] Rudolf Strauss. Surface Mount Technology , 1994 .
[8] A. D. Romig,et al. Phase equilibria of the cu-in system I: Experimental investigation , 1993 .
[9] Sinn-wen Chen,et al. Application of thermodynamic models to the calculation of solidification paths of Al-Rich Al−Li alloys , 1991 .
[10] Sinn-wen Chen,et al. Determination of the solidification curves of commercial aluminum alloys , 1996 .
[11] Sinn-wen Chen,et al. Calculation of phase diagrams and solidification paths of Al-rich Al−Li−Cu alloys , 1991 .
[12] C. Melton. The effect of reflow process variables on the wettability of lead-free solders , 1993 .
[13] Allan P. Gray,et al. A Simple Generalized Theory for the Analysis of Dynamic Thermal Measurement , 1968 .
[14] J. Glazer. Metallurgy of low temperature Pb-free solders for electronic assembly , 1995 .