Single-wafer cluster tool performance: an analysis of the effects of redundant chambers and revisitation sequences on throughput

Recent trends in the semiconductor industry indicate the need to explore alternatives to batch-wafer manufacturing. One proposed alternative is a micro-factory based on cluster tools. This paper presents an analysis of the effect of redundant chambers and chamber revisitation process sequences on the throughput in an individual cluster tool. Theoretical models which quantify the time required to process a lot of wafers in a cluster tool are developed for these situations. The differences between scheduling algorithms which use the load-lock as a queue and those that do not are also explored. Finally, the models developed in the work are integrated into a model which bounds the minimum theoretical turn-around-time which can be achieved in a cluster based fab.

[1]  Krishna C. Saraswat,et al.  Configuration and management strategies for cluster-based fabs , 1993, [1993 Proceedings] IEEE/SEMI International Semiconductor Manufacturing Science Symposium.

[2]  Todd LeBaron,et al.  The simulation of cluster tools: a new semiconductor manufacturing technology , 1994, Proceedings of Winter Simulation Conference.

[3]  R. S. Gyurcsik,et al.  Single-wafer cluster tool performance: an analysis of throughput , 1994 .

[4]  J. Quadrat,et al.  A linear-system-theoretic view of discrete-event processes , 1983, The 22nd IEEE Conference on Decision and Control.

[5]  P. J. Miller,et al.  Analysis Of Cluster Tool Performance In Semiconductor Manufacturing , 1992, Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium.