A full-wave characterization of an interconnecting line printed on a dielectric slab backed by a gridded ground plane

The electromagnetic behavior of a planar structure formed by a conducting strip printed on a dielectric slab backed by a gridded ground plane is analyzed in order to outline the characteristics of this type of interconnect often used in microwave integrated circuits and digital applications. A two-port equivalent model, based on the Z-matrix network representation, is adopted to study the electrical properties of the structure. The Z-parameters have been determined by means of a full-wave spectral domain methodology. Numerical results concerning the properties of this type of interconnect for different grid geometries are presented, and the effects related to the radiation from the strip and the gridded ground plane are pointed out.

[1]  J. R. Brews,et al.  Characteristic Impedance of Microstrip Lines , 1987 .

[2]  Paolo Bernardi,et al.  Dyadic Green's functions for conductor-backed layered structures excited by arbitrary tridimensional sources , 1994 .

[3]  Raj Mittra,et al.  The propagation characteristics of signal lines embedded in a multilayered structure in the presence of a periodically perforated ground plane , 1988 .

[4]  N. Alexopoulos,et al.  Current distribution and input impedance of printed dipoles , 1981 .

[5]  H. L. Bertoni,et al.  Waves Guided by Conductive Strips Above a Periodically Perforated Ground Plane , 1983 .

[6]  Henry W. Ott,et al.  Digital Circuit Grounding and Interconnection , 1981, 1981 IEEE International Symposium on Electromagnetic Compatibility.

[7]  T. Itoh Spectral Domain Immitance Approach for Dispersion Characteristics of Generalized Printed Transmission Lines , 1980 .

[8]  R. H. Jansen,et al.  The Spectral-Domain Approach for Microwave Integrated Circuits , 1985 .

[9]  B. J. Rubin,et al.  The Propagation Characteristics of Signal Lines in a Mesh-Plane Environment , 1984 .

[10]  D. Jackson,et al.  Analysis of planar strip geometries in a substrate-superstrate configuration , 1986 .

[11]  C. R. Paul,et al.  Modeling electromagnetic interference properties of printed circuit boards , 1989 .

[12]  Rakesh Chadha,et al.  Computer Aided Design of Microwave Circuits , 1978 .

[13]  R. Mittra,et al.  Spectral-Domain Approach for Calculating the Dispersion Characteristics of Microstrip Lines (Short Papers) , 1973 .

[14]  B. K. Gilbert,et al.  Analysis of transmission lines of finite thickness above a periodically perforated ground plane at oblique orientations , 1995 .

[15]  T. S. Smith,et al.  Effect of grid spacing on the inductance of ground grids , 1991, IEEE 1991 International Symposium on Electromagnetic Compatibility.