论文信息 - Solder Paste on the Quality of the Welding and 3D Detection Method

Solder Paste on the Quality of the Welding and 3D Detection Method

SPI (Solder Paste Inspection) refers to the solder paste detection system, the main function is to detect the quality of solder paste printing, including volume, area, height, XY offset, shape, bridge and so on. How to quickly and accurately detect very small solder paste, the general use of PMP (Chinese translation for the phase modulation profile measurement technology) and Laser (Chinese translation for the laser triangulation technology) detection principle.

Junjie Lv

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