Highly integrated VCSEL-based 10Gb/s miniature optical sub-assembly
暂无分享,去创建一个
C. Kopp | J. Berggren | L. Lombard | M. Volpert | P. Sundgren | R. Stevens | R. Hamelin | M. Hammar | P. Sundgren | M. Hammar | J. Berggren | C. Kopp | R. Stevens | R. Hamelin | L. Lombard | F. Berger | S. Bernabe | S. Bernabé | F. Berger | C. Rossat | C. Rossat | M. Volpert
[1] David Klotzkin,et al. High-speed directly modulated Fabry-Perot and distributed-feedback spot-size-converted lasers suitable for passive alignment, unisolated operation, and uncooled environments up to 85/spl deg/C , 2003 .
[2] James K. Guenter,et al. Reliability of various size oxide aperture VCSELs , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
[3] Laurent Fulbert,et al. PLATIMO: versatile assembling facilities to bring concepts to prototypes and automated production , 2004, SPIE Optical Systems Design.
[4] Peter Van Daele,et al. A parallel optical interconnect link with on-chip optical access , 2004, SPIE Photonics Europe.
[5] Jesper Berggren,et al. High-performance 1.3 µm InGaAs vertical cavity surface emitting lasers , 2003 .
[6] William K. Hogan,et al. Evolution of optical subassemblies in IBM data communication transceivers , 2003, IBM J. Res. Dev..
[7] Eric Zbinden,et al. Process development for 10 Gb/s small footprint butterfly transmitter , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[8] Naoya Kukutsu,et al. Accurate, stable, high-speed interconnections using 20- to 30-/spl mu/m-diameter microsolder bumps , 1997 .
[9] K. Panter,et al. Microsystems and wafer processes for volume-production of highly reliable fiber optic components for telecom- and datacom-application , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.