Optimization of black oxide coating thickness as an adhesion promoter for copper substrate in plastic integrated-circuit packages
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Jang-Kyo Kim | Matthew Ming Fai Yuen | W. K. Szeto | M. Yuen | Jang‐Kyo Kim | Mohamed Lebbai | Wing Kam Szeto | Penger Tong | M. Lebbai | W. Szeto | P. Tong | P. Tong
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