High performance BiCMOS process integration: trends, issues, and future directions

This work will review trends for high performance BiCMOS technology. A section comparing CMOS and Bipolar for RF attempts to forecast the future need for BiCMOS. This is followed by the status on Bipolar scaling trends and directions. A detailed section on BiCMOS process integration from starting substrate to final metal comprises the bulk of the paper. Key figures-of-merit for several BiCMOS processes in a variety of different application areas are summarized.

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