Evaluation of High Frequency Switching Capability of SiC Schottky Barrier Diode, Based on Junction Capacitance Model

An SiC power device possesses features like high breakdown voltage, fast switching capability, and high temperature operation, and is expected to be superior to conventional Si power devices. This paper clarifies the switching capability of an SiC Schottky barrier diode (SBD) in rectification of high frequency ac voltage. The dynamic behavior of the SiC SBD for switching operation is modeled based on semiconductor physics and device structure, and is characterized by its dc current-voltage (I-V) and ac capacitance-voltage (C-V) characteristics. A C-V characterization system, which measures capacitance using a dc bias voltage corresponding to the maximum rated voltage of the SiC SBD, is developed. The C-V characteristics are evaluated through experiments over the rated voltage range. These results explain the punch-through structure and device parameters. The dynamic behavior of the proposed model is validated through experiments on half-wave rectification of ac voltages over a wide frequency range. As a relational expression of voltage, current, and frequency of an applied ac sinusoidal voltage, the performance criterion of the device is established for rectification. The model also quantitatively assesses the switching capability of SiC SBDs. The model and performance criteria are beneficial for circuit design and device evaluation.

[1]  E. Santi,et al.  An assessment of wide bandgap semiconductors for power devices , 2003 .

[2]  J.D. van Wyk,et al.  An integrated CoolMOS FET/SiC diode module for high performance power switching , 2004, 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551).

[3]  S. Bayne,et al.  Advanced operational techniques and pn-pn-pn structures for high-power silicon carbide gate turn-off thyristors , 2001, APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181).

[4]  A. Radun,et al.  A 1-MHz hard-switched silicon carbide DC–DC converter , 2003, IEEE Transactions on Power Electronics.

[5]  H. Grubin The physics of semiconductor devices , 1979, IEEE Journal of Quantum Electronics.

[6]  H. Akagi,et al.  A Bidirectional Isolated DC–DC Converter as a Core Circuit of the Next-Generation Medium-Voltage Power Conversion System , 2007, IEEE Transactions on Power Electronics.

[7]  B. Jayant Baliga Material Properties and Technology , 2006 .

[8]  R. Singh,et al.  Silicon carbide PiN and merged PiN Schottky power diode models implemented in the Saber circuit simulator , 2004, IEEE Transactions on Power Electronics.

[9]  J. S. Wang,et al.  Differential capacitance measurements of relaxation-induced defects in InGaAs/GaAs Schottky diodes , 2001 .

[10]  B. Ozpineci,et al.  Characterization of SiC Schottky diodes at different temperatures , 2003, IEEE Power Electronics Letters.

[11]  M. Corradin,et al.  Performance evaluation of a Schottky SiC power diode in a boost PFC application , 2002 .

[12]  D. Kerns,et al.  PECVD diamond-based high performance power diodes , 2005, IEEE Transactions on Power Electronics.

[13]  J.D. van Wyk,et al.  High Temperature Embedded SiC Chip Module (ECM) for Power Electronics Applications , 2007, IEEE Transactions on Power Electronics.

[14]  B. J. Baliga Silicon Carbide Power Devices , 2005 .

[15]  Allen R. Hefner,et al.  SiC power diodes provide breakthrough performance for a wide range of applications , 2001 .

[16]  Takashi Hikihara,et al.  Switching characteristics of SiC JFET and Schottky diode in high-temperature dc-dc power converters , 2005, IEICE Electron. Express.

[17]  H. Mantooth,et al.  Power Conversion With SiC Devices at Extremely High Ambient Temperatures , 2007, IEEE Transactions on Power Electronics.

[18]  Sei-Hyung Ryu,et al.  Silicon Carbide Power MOSFET Model and Parameter Extraction Sequence , 2007, IEEE Transactions on Power Electronics.

[19]  Takashi Hikihara,et al.  SiC JFET dc characteristics under extremely high ambient temperatures , 2004, IEICE Electron. Express.

[20]  Takashi Hikihara,et al.  Evaluation of capacitance-voltage characteristics for high voltage SiC-JFET , 2007, IEICE Electron. Express.

[21]  S. Yoshida,et al.  Switching Characteristics of GaN HFETs in a Half Bridge Package for High Temperature Applications , 2008, IEEE Transactions on Power Electronics.

[22]  Takashi Hikihara,et al.  Characterization of punch-through phenomenon in SiC-SBD by capacitance-voltage measurement at high reverse bias voltage , 2006, IEICE Electron. Express.