论文信息 - High Level Integrated ICs for Low Cost, Compact, WiMax Dual-band RF Modules - 字舞流文

High Level Integrated ICs for Low Cost, Compact, WiMax Dual-band RF Modules

High level integrated passive and active ICs on GaAs substrates are developed for low cost, compact size WiMax dual-band RF module applications.

C. Yuen | K. Laursen | M. Adams | Due Chu | Hai Nguyen

[1] C. Yuen,et al. Single chip RF front-end MMIC solutions for future low cost, miniature size, WLAN transceiver module applications , 2005, 2005 Asia-Pacific Microwave Conference Proceedings.