Board-level reliability of Pb-free solder joints of TSOP and various CSPs
暂无分享,去创建一个
Seung Wook Yoon | Jun Ki Hong | S. Yoon | Kwang-yoo Byun | Kwang Yoo Byun | Hwankyu Kim | Hwa Jung Kim
[1] J. Glazer. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review , 1994 .
[2] Semyon Vaynman,et al. Flux development for lead-free solders containing zinc , 2000 .
[3] Seung Wook Yoon,et al. Thermodynamics-aided alloy design and evaluation of Pb-free solder, Sn-Bi-In-Zn system , 1997 .
[4] C. Melton. The effect of reflow process variables on the wettability of lead-free solders , 1993 .
[5] Yasuhisa Yamaji,et al. New evaluation method of CSPs board level reliability using strain gauge , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
[6] Semyon Vaynman,et al. Investigation of multi-component lead-free solders , 1994 .
[7] Sung K. Kang,et al. Lead (Pb)-free solders for electronic packaging , 1994 .
[8] Robert W. Messler,et al. Microstructure evolution of eutectic Sn-Ag solder joints , 1994 .
[9] S. H. Ho,et al. Reliability and failure analysis of CSP under bending cycling test , 2000 .
[10] U. D. Perera,et al. Evaluation of reliability of BGA solder joints through twisting and bending 1 1 An earlier version , 1999 .
[11] Sungho Jin,et al. Developing lead-free solders: A challenge and opportunity , 1993 .
[12] Hyuck-Mo Lee,et al. Investigation of the phase equilibria in the Sn-Bi-In alloy system , 1999 .