Silicon-on-insulator based high-temperature electronics for automotive applications

In recent years increasing demand for hybrid electric vehicle has generated the need for reliable and low-cost high-temperature electronics which can operate at the extreme temperatures that exists under the hood. A high-voltage and high-temperature gate-driver integrated circuit for SiC FET switches is designed and implemented in a 0.8-micron Silicon-on-Insulator high-voltage process. First prototype chip has been successfully tested up to 200degC ambient temperature without any heat sink or cooling mechanism. This gate-driver chip is intended to drive SiC power FETs of the DC-DC converters in a hybrid electric vehicle. The converter modules along with the gate-driver chip will be placed very close to the engine where the temperature can reach up to 175degC. Successful operation of the chip at this temperature with or without minimal heat sink and without liquid cooling will help achieve greater power-to-volume as well as power-to-weight ratios for the power electronics module. A second prototype has also been designed with more robust features.

[1]  J.P. Colinge SOI for hostile environment applications , 2004, 2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573).

[2]  J.W. Kolar,et al.  A simple, low cost gate drive method for practical use of SiC JFETs in SMPS , 2005, 2005 European Conference on Power Electronics and Applications.

[3]  L. Tolbert,et al.  An SOI-based High-Voltage, High-Temperature Gate-Driver for SiC FET , 2007, 2007 IEEE Power Electronics Specialists Conference.

[4]  Ghavam G. Shahidi,et al.  0.25 /spl mu/m low power CMOS devices and circuits from 8 inch SOI materials , 1995, Proceedings of 4th International Conference on Solid-State and IC Technology.

[5]  J. Kolar,et al.  A SiC JFET driver for a 5 kW, 150 kHz three-phase PWM converter , 2005, Fourtieth IAS Annual Meeting. Conference Record of the 2005 Industry Applications Conference, 2005..

[6]  J.W. Kolar,et al.  A novel SiC J-FET gate drive circuit for sparse matrix converter applications , 2004, Nineteenth Annual IEEE Applied Power Electronics Conference and Exposition, 2004. APEC '04..

[7]  Johann W. Kolar,et al.  A gate drive circuit for silicon carbide JFET , 2003, IECON'03. 29th Annual Conference of the IEEE Industrial Electronics Society (IEEE Cat. No.03CH37468).

[8]  H. Moghbelli,et al.  New Generation of Passenger Vehicles: FCV or HEV? , 2006, 2006 IEEE International Conference on Industrial Technology.

[9]  P. Neudeck,et al.  High-temperature electronics - a role for wide bandgap semiconductors? , 2002, Proc. IEEE.

[10]  R.W. Johnson,et al.  The changing automotive environment: high-temperature electronics , 2004, IEEE Transactions on Electronics Packaging Manufacturing.

[11]  A. Khaligh,et al.  Power electronics intensive solutions for advanced electric, hybrid electric, and fuel cell vehicular power systems , 2006, IEEE Transactions on Power Electronics.

[12]  Peter Jacobsen,et al.  High temperature automotive electronics , 2002 .

[13]  Donal Heffernan,et al.  Expanding Automotive Electronic Systems , 2002, Computer.

[14]  D. Giannopoulos,et al.  A low loss high-frequency half-bridge driver with integrated power devices using EZ-HV SOI technology , 2002, APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335).