A V-band front-end with 3-D integrated cavity filters/duplexers and antenna in LTCC technologies

This paper presents a compact system-on-package-based front-end solution for 60-GHz-band wireless communication/sensor applications that consists of fully integrated three-dimensional (3-D) cavity filters/duplexers and antenna. The presented concept is applied to the design, fabrication, and testing of V-band (receiver (Rx): 59-61.5 GHz, transmitter (Tx): 61.5-64 GHz) transceiver front-end module using multilayer low-temperature co-fired ceramic technology. Vertically stacked 3-D low-loss cavity bandpass filters are developed for Rx and Tx channels to realize a fully integrated compact duplexer. Each filter exhibits excellent performance (Rx: IL<2.37 dB, 3-dB bandwidth (BW) /spl sim/3.5%, Tx: IL<2.39 dB, 3-dB BW /spl sim/3.33%). The fabrication tolerances contributing to the resonant frequency experimental downshift were investigated and taken into account in the simulations of the rest devices. The developed cavity filters are utilized to realize the compact duplexers by using microstrip T-junctions. This integrated duplexer shows Rx/Tx BW of 4.20% and 2.66% and insertion loss of 2.22 and 2.48 dB, respectively. The different experimental results of the duplexer compared to the individual filters above are attributed to the fabrication tolerance, especially on microstrip T-junctions. The measured channel-to-channel isolation is better than 35.2 dB across the Rx band (56-58.4 GHz) and better than 38.4 dB across the Tx band (59.3-60.9 GHz). The reported fully integrated Rx and Tx filters and the dual-polarized cross-shaped patch antenna functions demonstrate a novel 3-D deployment of embedded components equipped with an air cavity on the top. The excellent overall performance of the full integrated module is verified through the 10-dB BW of 2.4 GHz (/spl sim/4.18%) at 57.45 and 2.3 GHz (/spl sim/3.84%) at 59.85 GHz and the measured isolation better than 49 dB across the Rx band and better than 51.9 dB across the Tx band.

[1]  J. Papapolymerou,et al.  Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology , 2005, IEEE Transactions on Microwave Theory and Techniques.

[2]  Ali M. Niknejad,et al.  Design considerations for 60 GHz CMOS radios , 2004, IEEE Communications Magazine.

[3]  G. Ponchak,et al.  Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 GHz , 2004, IEEE Transactions on Microwave Theory and Techniques.

[4]  M. Fujise,et al.  Miniature 60 GHz transmitter/receiver modules on AlN multi-layer high temperature co-fired ceramic , 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).

[5]  L. Katehi,et al.  A vertically integrated micromachined filter , 2002 .

[6]  F.M. Pitschi,et al.  On the design of an FBAR PCS duplexer in LTCC chip-sized package , 2004, IEEE Ultrasonics Symposium, 2004.

[7]  Jun Tsutsumi,et al.  High-frequency SAW duplexer with low-loss and steep cut-off characteristics , 2002, 2002 IEEE Ultrasonics Symposium, 2002. Proceedings..

[8]  M. Tentzeris,et al.  A highly integrated 3D millimeter-wave filter using LTCC system-on-package (SOP) technology for V-band WLAN gigabit wireless systems , 2005, 2005 Asia-Pacific Microwave Conference Proceedings.

[9]  J. Papapolymerou,et al.  Low-loss LTCC cavity filters using system-on-package technology at 60 GHz , 2005, IEEE Transactions on Microwave Theory and Techniques.

[10]  Keiichi Ohata,et al.  Sixty-GHz-band ultra-miniature monolithic T/R modules for multimedia wireless communication systems , 1996 .

[11]  Chul Soon Park,et al.  A very compact 60GHz transmitter integrating GaAs MMICs on LTCC passive circuits for wireless terminals applications , 2004, IEEE Compound Semiconductor Integrated Circuit Symposium, 2004..

[12]  F. Kuroki,et al.  Filter-based NRD-guide duplexer with low loss and high isolation at 60 GHz , 2004 .

[13]  Jia-Sheng Hong,et al.  Microstrip filters for RF/microwave applications , 2001 .

[14]  K. Kornegay.  60 GHz radio design challenges , 2003, 25th Annual Technical Digest 2003. IEEE Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2003..

[15]  J. Papapolymerou,et al.  Simulated and measured results from a Duroid-based planar MBG cavity resonator filter , 2000, IEEE Microwave and Guided Wave Letters.

[16]  Robert Aigner,et al.  A miniature BAW duplexer using flip-chip on LTCC , 2003, IEEE Symposium on Ultrasonics, 2003.

[17]  Keiichi Ohata,et al.  60 GHz-band ultra-miniature monolithic T/R modules for multimedia wireless communication systems , 1996, IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers.

[18]  Arne F. Jacob,et al.  Vertical Feedthroughs for Millimeter-Wave LTCC Modules , 2003, 2003 33rd European Microwave Conference, 2003.

[19]  Keiichi Ohata,et al.  1.25 Gbps wireless Gigabit ethernet link at 60 GHz-band , 2003, IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, 2003.