Experimental investigation of p-Si (100) surface modified by ion implantation

Surface strengthening and residual stress in Ti+ implanted p-Si (100) wafers are investigated by scanning electron microscopy, X-ray diffraction, nano-indentation and micro-Raman spectroscopy. The experimental results revealed that the crystallinity decreases gradually in transition area, whose structure varies continuously from the crystalline Si to amorphous phase which appears in ion implanted area. Moreover, the hardness and elastic modulus increase gradually in the transition area. Compressive intrinsic-stress that comes from lattice mismatch between the implanted layer and Si substrate is one factor giving rise to residual stresses.