论文信息 - Multichip module packaging of microelectromechanical systems

Multichip module packaging of microelectromechanical systems

Abstract Methods of packaging microelectromechanical systems (MEMS) using two advanced multichip module (MCM) foundry processes are described. Special-purpose surface and bulk micromachined MEMS packaging test dies were designed and fabricated. The MEMS test dies were successfully packaged with CMOS electronics dies using the ‘chips first’ General Electric high-density interconnect (HDI) technology. Methods for reducing the potential for laser-induced damage and residue formation in the HDI process are demonstrated. The micro module systems MCM-D process was also successfully investigated for applicability to MEMS packaging. Development of MEMS compatible MCM packaging provides an alternative to monolithic fabrication for integration of MEMS and microelectronics.

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