Microfabrication process for high-frequency power-conversion transformers

A process for microfabrication of transformers for high-frequency power conversion applications is described. The process uses multilayer films of NiFe/SiO/sub 2/ magnetic material and copper coils deposited on a silicon substrate. Transformers less than 100 /spl mu/m thick are designed to handle 1.7 W each in an area 1.5 by 5.4 mm. Coil measurements confirm predicted DC and AC resistance. Applications to a 10 W, 10 MHz DC-DC power converter are discussed.<<ETX>>

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