Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation

Analog-to-digital converter (ADC) is becoming of utmost importance in an automotive environment. With the increased number of magnetic field sources near the ADC that can alter its behaviors significantly, we need to model how magnetic field affects the performance of the ADC. Therefore, in order to accurately evaluate the practical performance of the ADC and the considerable off-chip and on-chip effects that are highly complex, the chip-printed circuit board (PCB) comodeling, cosimulation, and coanalysis are required. In this study, a comodel of the magnetic field effects on an ADC is proposed. The proposed comodel includes three separate submodels: a model of the magnetic field coupling from the wireless power transfer (WPT) system input to the PCB integrated with ADC, a model of the noise coupling from the PCB to the ADC input, and a model of the ADC behavior from the ADC input to the ADC outputs. Considering the magnetic field coupling from the magnetic field source to the PCB, a new inductive transmission line model (I-TLM) method is developed. This method achieves fast, precise, and broadband estimation of the magnetic field effects in comparison to previous estimation methods. To validate the proposed comodel, an ADC is fabricated using a 0.13-μm complementary metal-oxide semiconductor process and is wire-bonded to the designed PCB for ADC. A PCB-level WPT system is designed and built as the magnetic field source. The performance factor of the ADC is measured by sweeping the WPT system input frequency from 100 kHz to 1 GHz to find out the critical WPT system frequency for the designed ADC with the chip-PCB hierarchical structure. The results estimated by the proposed model correlate well with the full 3-D electromagnetic field simulation and measurement. The proposed modeling procedure reduces the time and computation resource in the design of the chip, package, and PCB to achieve high-quality analog devices or mixed-mode systems, while also providing an intuitive understanding of the radiated noise effect.

[1]  Liang Chen,et al.  Chip and package co-design for high performance mixed IC , 2010, 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology.

[2]  Ka Wai Eric Cheng,et al.  A simplified Neumann's formula for calculation of inductance of spiral coil , 2000 .

[3]  Hiroki Shoki,et al.  Issues and Initiatives for Practical Deployment of Wireless Power Transfer Technologies in Japan , 2013, Proceedings of the IEEE.

[4]  Jun Fan,et al.  Extracting physical IC models using near-field scanning , 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

[5]  Joungho Kim,et al.  Vertical noise coupling on wideband low noise amplifier from on-chip switching-mode DC-DC converter in 3D-IC , 2011, 2011 8th Workshop on Electromagnetic Compatibility of Integrated Circuits.

[6]  Andreas C. Cangellaris,et al.  Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent-circuit formulation , 1997 .

[7]  S. Wong,et al.  Physical modeling of spiral inductors on silicon , 2000 .

[8]  Madhavan Swaminathan,et al.  Modeling of irregular shaped power distribution planes using transmission matrix method , 2001 .

[9]  A. Platonov,et al.  Particularities of the Cyclic A/D Converters ENOB Definition and Measurement , 2006, 2006 IEEE Instrumentation and Measurement Technology Conference Proceedings.

[10]  Dong-Ho Cho,et al.  Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System , 2013, Proceedings of the IEEE.

[11]  M. Koen High performance analog to digital converter architectures , 1989, Proceedings of the Bipolar Circuits and Technology Meeting.

[12]  Young-il Kim,et al.  Structure of handheld resonant magnetic coupling charger (HH-RMCC) for electric vehicle considering electromagnetic field , 2013, 2013 IEEE Wireless Power Transfer (WPT).

[13]  R.R. Tummala,et al.  The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade , 2004, IEEE Transactions on Advanced Packaging.

[14]  K. Appeltans,et al.  Technology considerations for automotive , 2004, Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850).

[15]  Seungyoung Ahn,et al.  Analytical expressions for maximum transferred power in wireless power transfer systems , 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

[16]  Dong-Ho Cho,et al.  Design and Implementation of Shaped Magnetic-Resonance-Based Wireless Power Transfer System for Roadway-Powered Moving Electric Vehicles , 2014, IEEE Transactions on Industrial Electronics.

[17]  W. G. Hurley,et al.  Calculation of self- and mutual impedances in planar sandwich inductors , 1997 .

[18]  Joungho Kim,et al.  Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis , 2013, IEEE Transactions on Electromagnetic Compatibility.

[19]  Mahdi Shahbakhti,et al.  Incorporation of implementation imprecision in automotive control design , 2013, 2013 American Control Conference.

[20]  J.L. Duarte,et al.  Implementation of the Neumann formula for calculating the mutual inductance between planar PCB inductors , 2008, 2008 18th International Conference on Electrical Machines.

[21]  Madhavan Swaminathan,et al.  Modeling of multilayered power distribution planes using transmission matrix method , 2002 .

[22]  Joungho Kim,et al.  Estimation of Vertical Noise Coupling on 900MHz Low Noise Amplifier from 200MHz On-chip Switching-mode Power Supply in 3D-IC , 2011 .