Effect of Process Temperature and Reaction Cycle Number on Atomic Layer Deposition of TiO2 Thin Films Using TiCl4 and H2O Precursors: Correlation Between Material Properties and Process Environment
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H. S. Maciel | W. Chiappim | G. Testoni | R. Pessoa | K. Grigorov | L. Vieira | H. S. Medeiros | J. S. Lima