Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems
暂无分享,去创建一个
[1] T. Kiga,et al. Thermal Fatigue Reliability and Mechanical Fatigue Reliability of Sn-Zn Solder Joints in Surface Mounting Process under Environmental Test , 2003 .
[2] Tetsuya Kobayashi,et al. A Study on the Solderbility and Joint Reliability of Lead-Free Sn-Zn-Al Solder , 2003 .
[3] K. Suganuma,et al. Microstructure Changes in Sn-Zn/Cu Joints During Heat-Exposure , 2002 .
[4] R. Schetty. Minimization of tin whisker formation for lead‐free electronics finishing , 2001 .
[5] M. Abtew,et al. Lead-free Solders in Microelectronics , 2000 .
[6] Katsuaki Suganuma,et al. Heat resistance of Sn-9Zn solder/Cu interface with or without coating , 2000 .
[7] Hyuck-Mo Lee,et al. Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate , 1999 .
[8] Koichi Niihara,et al. Wetting and interface microstructure between Sn–Zn binary alloys and Cu , 1998 .
[9] Dong Nyung Lee,et al. Spontaneous growth mechanism of tin whiskers , 1998 .
[10] K. Tu. Cu/Sn interfacial reactions: thin-film case versus bulk case , 1996 .
[11] E. P. Wood,et al. In search of new lead-free electronic solders , 1994 .
[12] Semyon Vaynman,et al. Investigation of multi-component lead-free solders , 1994 .
[13] Tu,et al. Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions. , 1994, Physical review. B, Condensed matter.
[14] C. Melton. The effect of reflow process variables on the wettability of lead-free solders , 1993 .
[15] M. Mccormack,et al. Progress in the design of new lead-free solder alloys , 1993 .
[16] U. Lindborg,et al. A model for the spontaneous growth of zinc, cadmium and tin whiskers , 1975 .
[17] Takashi Furusawa,et al. Rate of Short Circuit Caused by Whisker Growth on Zn Electroplated Steels in Electronic Appliance , 1989 .