Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems

[1]  T. Kiga,et al.  Thermal Fatigue Reliability and Mechanical Fatigue Reliability of Sn-Zn Solder Joints in Surface Mounting Process under Environmental Test , 2003 .

[2]  Tetsuya Kobayashi,et al.  A Study on the Solderbility and Joint Reliability of Lead-Free Sn-Zn-Al Solder , 2003 .

[3]  K. Suganuma,et al.  Microstructure Changes in Sn-Zn/Cu Joints During Heat-Exposure , 2002 .

[4]  R. Schetty Minimization of tin whisker formation for lead‐free electronics finishing , 2001 .

[5]  M. Abtew,et al.  Lead-free Solders in Microelectronics , 2000 .

[6]  Katsuaki Suganuma,et al.  Heat resistance of Sn-9Zn solder/Cu interface with or without coating , 2000 .

[7]  Hyuck-Mo Lee,et al.  Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate , 1999 .

[8]  Koichi Niihara,et al.  Wetting and interface microstructure between Sn–Zn binary alloys and Cu , 1998 .

[9]  Dong Nyung Lee,et al.  Spontaneous growth mechanism of tin whiskers , 1998 .

[10]  K. Tu Cu/Sn interfacial reactions: thin-film case versus bulk case , 1996 .

[11]  E. P. Wood,et al.  In search of new lead-free electronic solders , 1994 .

[12]  Semyon Vaynman,et al.  Investigation of multi-component lead-free solders , 1994 .

[13]  Tu,et al.  Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions. , 1994, Physical review. B, Condensed matter.

[14]  C. Melton The effect of reflow process variables on the wettability of lead-free solders , 1993 .

[15]  M. Mccormack,et al.  Progress in the design of new lead-free solder alloys , 1993 .

[16]  U. Lindborg,et al.  A model for the spontaneous growth of zinc, cadmium and tin whiskers , 1975 .

[17]  Takashi Furusawa,et al.  Rate of Short Circuit Caused by Whisker Growth on Zn Electroplated Steels in Electronic Appliance , 1989 .