Post-Lamination Manufacturing Process Automation for Photovoltaic Modules: Final Subcontract Report, April 1998 - April 2002

This report describes the automated systems developed for PV module assembly and testing processes after lamination. These processes are applicable to a broad range of module types, including those made with wafer-based and thin-film solar cells. Survey data and input from module manufacturers gathered during site visits were used to define system capabilities and process specifications. Spire completed mechanical, electrical, and software engineering for four automation systems: a module edge trimming system, the SPI-TRIM 350; an edge sealing and framing system, the SPI-FRAMER 350; an integrated module testing system, the SPI-MODULE QA 350; and a module buffer storage system, the SPI-BUFFER 350. A fifth system for junction-box installation, the SPI-BOXER 350, was nearly completed during the program. A new-size solar simulator, the SPI-SUN SIMULATOR 350i, was designed as part of the SPI-MODULE QA 350. This simulator occupies minimal production floor space, and its test area is large enough to handle most production modules. The automated systems developed in this program are designed for integration to create automated production lines.