Analysis of thermoelectric coolers by a spice-compatible equivalent-circuit model
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[1] G. Vineyard,et al. Semiconductor Thermoelements and Thermoelectric Cooling , 1957 .
[2] Erwin De Baetselier,et al. A survey of the thermal stability of an active heat sink , 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.
[3] J. M. Coulson,et al. Heat Transfer , 2018, Finite Element Method for Solids and Structures.
[4] J.A. Ortega,et al. SPICE model of thermoelectric elements including thermal effects , 2000, Proceedings of the 17th IEEE Instrumentation and Measurement Technology Conference [Cat. No. 00CH37066].
[5] Bin-Juine Huang,et al. System dynamic model and temperature control of a thermoelectric cooler , 2000 .
[6] E. Dallago,et al. Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. II. Practice and experiments , 1998 .
[7] E. Dallago,et al. Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. I. Fundamentals and theory , 1998 .
[8] S. L. Soo. Direct Energy Conversion , 1968 .