The stabilization of electrodeposited copper powder

[1]  R. Walker,et al.  The morphology and properties of electrodeposited copper powder , 1984 .

[2]  A. G. Zhigotskii,et al.  Thermal stability of composite electrolytic iron powders in air and inert atmospheres , 1984 .

[3]  T. Shvets,et al.  Surface stabilization of fine iron powders by epoxy oligomers , 1984 .

[4]  K. Hirakawa,et al.  Electrochemical Hydrogen-Storage in Ti–Mn Alloy Electrodes , 1983 .

[5]  H. Exner Role of interfaces in sintering , 1982 .

[6]  I. Bear,et al.  Swelling of Precipitated Nickel Powder , 1980 .

[7]  A. Reed,et al.  Electrodeposition of metal powders , 1979 .

[8]  N. Litvishko,et al.  Effects of a pulsating electric current on the physicomechanical properties of copper powder , 1974 .

[9]  R. Walker,et al.  Benzotriazole as a Corrosion Inhibitor for Immersed Copper , 1973 .

[10]  V. Shlyuko,et al.  A technique for studying solid-phase contact interaction with the aid of electron-beam heating , 1970 .

[11]  R. Walker The use of benzotriazole as a corrosion inhibitor for copper , 1970 .

[12]  K. Farrell,et al.  Thermal rejection and growth of gas bubbles in electrodeposited nickel , 1970 .

[13]  I. Sendzimir,et al.  Corrosion of powdered copper during prolonged storage , 1969 .

[14]  H. McCoy,et al.  STRESS-INDUCED GROWTH OF GAS BUBBLES IN SOLIDS. , 1968 .

[15]  R. Kelly Bubble Diffusion and the Motion of Point Defects near Surfaces. (Diffusion Theory for Discrete Media, Part IV† , 1967 .

[16]  A. Boltax,et al.  The role of fission gas re-solution during post-irradiation heat treatment , 1962 .