The logical complexity of queries on unordered graphs

The beam lead tool is for picking up and bonding semi-conductor wafers or dice to a substrate and includes an accommodating recess in which the wafer is positioned and a suction duct for permitting the wafer to be retained in the tool. The tool is formed as a tip at one end having a peripheral beam lead contacting surface that is formed by a grinding and lapping process wherein a radius or other curvature is defined along the inner facing edges defined by the contacting surface. The surface is first ground to a flatness and is then lapped by a vibratory motion against a resilient stationary pad such as a chamois impregnated with an abrasive material such as a conventional diamond paste.