Three-Dimensional Paddle Shift Modeling for IC Packaging
暂无分享,去创建一个
[1] Louis Thomas Manzione,et al. Plastic Packaging of Microelectronic Devices , 1990 .
[2] Jose M. Castro,et al. KINETICS AND RHEOLOGY OF TYPICAL POLYURETHANE REACTION INJECTION MOLDING SYSTEMS. , 1980 .
[3] Sejin Han,et al. Flow Analysis in a Chip Cavity During Semiconductor Encapsulation , 2000 .
[4] Avraam Isayev,et al. Injection and Compression Molding Fundamentals , 1987 .
[5] S. A. Bidstrup-Allen,et al. Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding , 2000 .
[6] F. Su,et al. Three-dimensional modeling of mold filling in microelectronics encapsulation process , 2004, IEEE Transactions on Components and Packaging Technologies.
[7] Sheng-Jye Hwang,et al. Prediction of paddle shift via 3-D TSOP modeling , 2000 .
[8] L. Turng,et al. On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound , 1993 .
[9] Wen-Hsien Yang,et al. Numerical simulation of mold filling in injection molding using a three‐dimensional finite volume approach , 2001 .