AlGaN/GaN power device technology for high current (100+ A) and high voltage (1.2 kV)

This paper extends our 650V rated GaN device technology to current ratings in excess of 100A. For the first time, devices with single digit Ron values are reported. A record low value of 6mΩ is measured at 100A. The device technology is shown to be fully current collapse free, over the complete voltage and temperature window. Intrinsic reliability test data up to Vds=900V, and T=200°C is provided. In addition, by using a thicker GaN buffer, 20A rated GaN power devices up to 1.2kV are presented, with leakage current ~100nA. This is a first step to allow AlGaN/GaN power devices to compete with Si IGBTs and SiC MOSFETs.

[1]  W. Marsden I and J , 2012 .

[2]  Fred C. Lee,et al.  Gate drive design considerations for high voltage cascode GaN HEMT , 2014, 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014.

[3]  D. Ueda,et al.  GaN on Si Technologies for Power Switching Devices , 2013, IEEE Transactions on Electron Devices.

[4]  J. Wurfl,et al.  Normally-off high-voltage p-GaN gate GaN HFET with carbon-doped buffer , 2011, 2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs.

[5]  G. Meneghesso,et al.  Impact of buffer leakage on intrinsic reliability of 650V AlGaN/GaN HEMTs , 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

[6]  S. Decoutere,et al.  200mm GaN-on-Si epitaxy and e-mode device technology , 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

[7]  G. Meneghesso,et al.  High-voltage double-pulsed measurement system for GaN-based power HEMTs , 2014, 2014 IEEE International Reliability Physics Symposium.

[8]  C. Tsai,et al.  A next generation CMOS-compatible GaN-on-Si transistors for high efficiency energy systems , 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

[9]  G. Deboy,et al.  The role of silicon, silicon carbide and gallium nitride in power electronics , 2012, 2012 International Electron Devices Meeting.

[10]  M. Uren,et al.  On the impact of carbon-doping on the dynamic Ron and off-state leakage current of 650V GaN power devices , 2015, 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD).

[11]  P. Gassot,et al.  An industrial process for 650V rated GaN-on-Si power devices using in-situ SiN as a gate dielectric , 2014, 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD).

[12]  D. Bour,et al.  1.5-kV and 2.2-m (Omega ) -cm (^{2}) Vertical GaN Transistors on Bulk-GaN Substrates , 2014 .

[13]  Daisuke Ueda,et al.  GaN monolithic inverter IC using normally-off gate injection transistors with planar isolation on Si substrate , 2009, 2009 IEEE International Electron Devices Meeting (IEDM).

[14]  M. Uren,et al.  Electric Field Reduction in C-Doped AlGaN/GaN on Si High Electron Mobility Transistors , 2015, IEEE Electron Device Letters.