论文信息 - Modeling and experimental verification of the interconnected mesh power system (IMPS) MCM topology

Modeling and experimental verification of the interconnected mesh power system (IMPS) MCM topology

A new low-cost multichip module (MCM) topology, the interconnected mesh power system (IMPS), has been shown capable of reducing the metal layers of a conventional four-layer MCM by half. To provide a complete MCM on only two metal layers, the IMPS topology provides a unique and complex power distribution system and signal transmission environment. This paper reports on models of the IMPS structure based on finite-difference/partial-inductance methods and PSpice simulation. The models can easily he constructed using a commercial three-dimensional (3-D) field solver and the circuit models can be solved by PSpice. The agreement between the modeled and measured results is excellent. Discrepancies between models and results are also discussed.

S. S. Ang | Y. L. Low | Leonard W. Schaper

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