Dynamic crosstalk analysis of mixed multi-walled carbon nanotube bundle interconnects

Multi-walled carbon nanotube (MWCNT) bundles have potentially provided attractive solutions in current nanoscale VLSI interconnects. From fabrication point of view, it is difficult to control the growth of a densely packed bundle having MWCNTs with similar diameters. A realistic bundle is combination of MWCNTs with different number of shells. Thus, this research work focuses on the analytical model of a bundle having the MWCNTs with different number of shells or in turn different diameters (mixed MWCNT bundle (MMB)). Based on the multi-conductor transmission line theory, an equivalent single conductor (ESC) model is employed for the proposed MMB arrangements. The ESC model of MMB is used to compare the dynamic crosstalk delay with conventionally arranged bundle containing MWCNTs with similar diameters (MWCNT bundle (MB)) under different input transition time and spacing conditions. It is observed that a realistic MMB correctly estimates the crosstalk delay for the different transition time that overestimates the delay of a conventionally arranged MB by 1.35 times. Moreover, the MMB arrangement reduces the overall crosstalk delay by 47.26% compared with the conventional MB arrangements for an inter-bundle spacing ranging from 5 to 30 nm.

[1]  J. Meindl,et al.  Performance Modeling for Single- and Multiwall Carbon Nanotubes as Signal and Power Interconnects in Gigascale Systems , 2008, IEEE Transactions on Electron Devices.

[2]  Jan M. Rabaey,et al.  Digital Integrated Circuits , 2003 .

[3]  Masud H. Chowdhury,et al.  Mixed carbon nanotube bundles for interconnect applications , 2009 .

[4]  P. Avouris,et al.  Current saturation and electrical breakdown in multiwalled carbon nanotubes. , 2001, Physical review letters.

[5]  D. Das,et al.  Analysis of Crosstalk in Single- and Multiwall Carbon Nanotube Interconnects and Its Impact on Gate Oxide Reliability , 2011, IEEE Transactions on Nanotechnology.

[6]  P. Avouris,et al.  Multishell conduction in multiwalled carbon nanotubes , 2002 .

[7]  M. S. Sarto,et al.  Single-Conductor Transmission-Line Model of Multiwall Carbon Nanotubes , 2010, IEEE Transactions on Nanotechnology.

[8]  P. Burke Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes , 2002 .

[9]  A. Naeemi,et al.  Physical Modeling of Temperature Coefficient of Resistance for Single- and Multi-Wall Carbon Nanotube Interconnects , 2007, IEEE Electron Device Letters.

[10]  Vasileios Koutsos,et al.  Electrical and mechanical properties of carbon nanotube-polyimide composites , 2009 .

[11]  R. C. Joshi,et al.  An analytical approach to dynamic crosstalk in coupled interconnects , 2010, Microelectron. J..

[12]  D. Pavlidis,et al.  Pronounced field emission from vertically aligned carbon nanotube blocks and bundles , 2011 .

[13]  Brajesh Kumar Kaushik,et al.  Crosstalk Analysis for a CMOS-Gate-Driven Coupled Interconnects , 2008, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[14]  S. Louie,et al.  Quantum conductance of multiwall carbon nanotubes , 2002 .

[15]  D. Rossi,et al.  Modeling Crosstalk Effects in CNT Bus Architectures , 2007, IEEE Transactions on Nanotechnology.

[16]  N. D. Pandya,et al.  Dynamic crosstalk effect in mixed cnt bundle interconnects , 2012 .

[17]  V. Tucci,et al.  Impact of the Variability of the Process Parameters on CNT-Based Nanointerconnects Performances: A Comparison Between SWCNTs Bundles and MWCNT , 2012, IEEE Transactions on Nanotechnology.

[18]  P. Ajayan,et al.  Reliability and current carrying capacity of carbon nanotubes , 2001 .

[19]  P. Avouris,et al.  Carbon-based electronics. , 2007, Nature nanotechnology.

[20]  Ali Javey,et al.  Carbon nanotube electronics , 2006, 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design (VLSID'06).

[21]  A. Srivastava,et al.  Carbon nanotubes for next generation very large scale integration interconnects , 2010 .

[22]  D. Glattli,et al.  Determination of the intershell conductance in multiwalled carbon nanotubes. , 2004, Physical review letters.

[23]  J.-Q. Lu,et al.  Densification of Carbon Nanotube Bundles for Interconnect Application , 2007, 2007 IEEE International Interconnect Technology Conferencee.

[24]  K. Banerjee,et al.  Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects , 2008, IEEE Transactions on Electron Devices.

[25]  A. Kawabata,et al.  Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles , 2006, 2006 International Interconnect Technology Conference.

[26]  C. Xu,et al.  Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects , 2009, IEEE Transactions on Electron Devices.