Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB

The return current path is the most critical part of high-speed interconnection design in both package and PCB. When the return current path is disturbed, significant amount of noise generation, coupling, and radiated emission problems occur. Signal vias and power/ground vias produce a return current path disconnect problem. In this paper, we demonstrate that the via is a major source of the SSN (simultaneous switching noise) generation, coupling, and edge radiated emission in multi-layer packages and PCBs.

[1]  Joungho Kim,et al.  PCB power/ground plane edge radiation excited by high-frequency clock , 2004, 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559).

[2]  Joungho Kim,et al.  Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module , 2004, 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559).

[3]  Joungho Kim,et al.  High dielectric constant thin film embedded capacitor for suppression of simultaneous switching noise and radiated emission , 2004, 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559).