Grid pattern for in-plane strain measurements by digital image processing

This paper presents a non-contact and non-destructive method for full-field in-plane strain measurements. Digital image processing is employed for monitoring the deformations of grid lines marked on a planar surface of a component or a specimen. Full-field in-plane strain distributions are obtained by processing the geometrical characteristics of the grid with computer graphics algorithms. The strain field determined in the necking zone of a tensile specimen has demonstrated the benefit of the method.

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