论文信息 - Mechanism of forming interfacial intermetallic compounds at interface for solid state diffusion bonding of dissimilar materials - 字舞流文

Mechanism of forming interfacial intermetallic compounds at interface for solid state diffusion bonding of dissimilar materials

[1] K. Bhanumurthy,et al. Diffusion bonding of commercially pure titanium to 304 stainless steel using copper interlayer , 2005 .

[2] T. Takenaka,et al. Reactive diffusion between Pd and Sn at solid-state temperatures , 2005 .

[3] M. Kajihara,et al. Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures , 2005 .

[4] S. Hong,et al. Reaction synthesis and microstructures of NiAl/Ni micro-laminated composites , 2005 .

[5] S. Das,et al. Variation in the reaction zone and its effects on the strength of diffusion bonded titanium–stainless steel couple , 2005 .

[6] M. Kajihara,et al. Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures , 2005 .

[7] T. Sheu,et al. Numerical simulation of diffusion-controlled solid-state reactions in spherical particles , 2004 .

[8] T. Sheu,et al. Numerical exploration of diffusion-controlled solid-state reactions in cubic particles , 2003 .

[9] Binggang Zhang,et al. A new technology for diffusion bonding intermetallic TiAl to steel with composite barrier layers , 2003 .

[10] N. L. Peterson. Diffusion in Metals , 1969 .