论文信息 - Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas - 字舞流文

Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas

P. Lefaucheux | R. Dussart | T. Tillocher | J. de Marneffe | M. Baklanov | F. Leroy | E. Nishimura | K. Yatsuda | L. Zhang | K. Maekawa