Rotary workbench device and wafer thinning machine

The invention provides a rotary workbench device and a wafer thinning machine and belongs to the separation type mechanical device field. The rotary workbench device comprises a fixing disk and a supporting disk; a workbench main shaft is fixed onto the fixing disk; the supporting disk is installed at the upper end of the workbench main shaft; the rotary workbench device further comprises a wafer carrying stage system; and the wafer carrying stage system includes a wafer carrying stage upper part which is used for carrying processing objects and a wafer carrying stage lower part which can be engaged with the wafer carrying stage upper part so as to drive the wafer carrying stage upper part to rotate, wherein the wafer carrying stage upper part is fixedly installed on the supporting disk, the wafer carrying stage lower part is fixedly installed on the fixing disk, and the wafer carrying stage upper part and the wafer carrying stage lower part are in engaged connection with each other between the fixing disk and the supporting disk. With the technical schemes of the invention adopted, the working efficiency of the workbench can be improved, the positioning precision of work station transformation can be improved, and grinding quality can be ensured.