A dual band (2G/5G) IEEE 802.11b/g/n/ac 80MHz bandwidth AMAM envelope feedback power amplifier with digital pre-distortion

A dual band (2G/5G) IEEE 802.11b/g/n/ac wide-band AM-AM envelope feedback power amplifier with digital pre-distortion is demonstrated in 40nm CMOS. This architect effectively improves both EVM and spectrum mask up to 20.9dBm in 40MHz bandwidth at 2G and 17.2dBm in 80MHz bandwidth in 5G. In addition, comparing to the conventional class AB PA, the power consumption is significantly reduced by 33% at low output power (<;6dBm) and 21% at high output power (>16dBm).

[1]  Jacques C. Rudell,et al.  A Class-G Switched-Capacitor RF Power Amplifier , 2013, IEEE Journal of Solid-State Circuits.

[2]  Pi-An Wu,et al.  A 2×2 MIMO 802.11 abgn/ac WLAN SoC with integrated T/R switch and on-chip PA delivering VHT80 256QAM 17.5dBm in 55nm CMOS , 2014, 2014 IEEE Radio Frequency Integrated Circuits Symposium.

[3]  Takashi Yamaguchi,et al.  A 28.3mW PA-closed loop for linearity and efficiency improvement integrated in a +27.1dBm WCDMA CMOS power amplifier , 2012, 2012 IEEE International Solid-State Circuits Conference.

[4]  Ali M. Niknejad,et al.  An Efficient Mixed-Signal 2.4-GHz Polar Power Amplifier in 65-nm CMOS Technology , 2011, IEEE Journal of Solid-State Circuits.

[5]  SungWon Chung,et al.  A 2.4-GHz, 27-dBm Asymmetric Multilevel Outphasing Power Amplifier in 65-nm CMOS , 2012, IEEE Journal of Solid-State Circuits.

[6]  Chao Lu,et al.  A 24.7dBm all-digital RF transmitter for multimode broadband applications in 40nm CMOS , 2013, 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers.

[7]  Takashi Yamaguchi,et al.  A 28.3 mW PA-Closed Loop for Linearity and Efficiency Improvement Integrated in a $+$ 27.1 dBm WCDMA CMOS Power Amplifier , 2012, IEEE Journal of Solid-State Circuits.

[8]  Li Lin,et al.  20.5 A 40nm dual-band 3-stream 802.11a/b/g/n/ac MIMO WLAN SoC with 1.1Gb/s over-the-air throughput , 2014, 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC).