Growth of a delta‐doped silicon layer by molecular beam epitaxy on a charge‐coupled device for reflection‐limited ultraviolet quantum efficiency

We have used low‐temperature silicon molecular beam epitaxy to grow a δ‐doped silicon layer on a fully processed charge‐coupled device (CCD). The measured quantum efficiency of the δ‐doped backside‐thinned EG&G Reticon CCD is in agreement with the reflection limit for light incident on the back surface in the spectral range of 260–600 nm. The 2.5 nm silicon layer, grown at 450 °C, contained a boron δ‐layer with surface density ∼2×1014 cm−2. Passivation of the surface was done by steam oxidation of a nominally undoped 1.5 nm Si cap layer. The UV quantum efficiency was found to be uniform and stable with respect to thermal cycling and illumination conditions.

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