High Ampacity Carbon Nanotube Materials
暂无分享,去创建一个
Javier Pozuelo | Juan Baselga | Javier Sanz | Guillermo Mokry | Juan J Vilatela | J. Baselga | G. Mokry | J. Pozuelo | J. Vilatela | J. Sanz
[1] K. R. Atkinson,et al. Multifunctional Carbon Nanotube Yarns by Downsizing an Ancient Technology , 2004, Science.
[2] Kwon,et al. Fractional quantum conductance in carbon nanotubes , 2000, Physical review letters.
[3] R. Khanna,et al. Control of tube parameters on SWCNT bundle interconnect delay and power dissipation , 2013 .
[4] T. Chou,et al. Immunotherapy of cancer. , 1970, British medical journal.
[5] W. Xu,et al. Effect of electrical current on tribological property of Cu matrix composite reinforced by carbon nanotubes , 2011 .
[6] John R. Reynolds,et al. Transparent, Conductive Carbon Nanotube Films , 2004, Science.
[7] A. Naeemi,et al. Cu Interconnect Limitations and Opportunities for SWNT Interconnects at the End of the Roadmap , 2013, IEEE Transactions on Electron Devices.
[8] Wei Zhou,et al. Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints , 2013 .
[9] J. Black,et al. Electromigration—A brief survey and some recent results , 1969 .
[10] T. V. Venkatesha,et al. Electrodeposition and properties of Zn–Ni–CNT composite coatings , 2009 .
[11] Qing Huo Liu,et al. Electrothermal Characterization of Single-Walled Carbon Nanotube (SWCNT) Interconnect Arrays , 2009, IEEE Transactions on Nanotechnology.
[12] S. Ramakrishna,et al. Carbon nanotube hybrid nanostructures: future generation conducting materials , 2016 .
[13] Y. Ikuhara,et al. Effect of alloying elements on the interfacial bonding strength and electric conductivity of carbon nano-fiber reinforced Cu matrix composites , 2007 .
[14] Gang Chen,et al. Carbon-nanotube/copper composite electrodes for capillary electrophoresis microchip detection of carbohydrates. , 2004, The Analyst.
[16] Katharina Wagner,et al. Design And Development Of Aircraft Systems , 2016 .
[17] X. B. Zhang,et al. Tribological properties of carbon-nanotube-reinforced copper composites , 2001 .
[18] Faliang Li,et al. Carbon Nanotube Reinforced Ceramic Composites: A Review , 2014, Interceram - International Ceramic Review.
[19] M. Polcari,et al. Observation of electromigration in heavily doped polycrystalline silicon thin films , 1980 .
[20] J. Kong,et al. Spinning and Processing Continuous Yarns from 4‐Inch Wafer Scale Super‐Aligned Carbon Nanotube Arrays , 2006 .
[21] M. Saka,et al. Basis of Atomic Diffusion , 2010 .
[22] S. Iijima. Helical microtubules of graphitic carbon , 1991, Nature.
[23] Rolf Landauer. Geometry and boundary conditions in the Das-Peierls electromigration theorem , 1977 .
[24] K. Hata,et al. The influence of Cu electrodeposition parameters on fabricating structurally uniform CNT-Cu composite wires , 2017 .
[25] J. Byun,et al. Electrodeposition and mechanical properties of Ni–carbon nanotube nanocomposite coatings , 2008 .
[26] F. Paraguay-Delgado,et al. New organometallic precursor catalysts applied to MWCNT synthesis by spray-pirolysis , 2006 .
[27] G. Beyer,et al. Electrical characterization of CNT contacts with Cu Damascene top contact , 2013 .
[28] M. Monthioux,et al. A significant improvement of both yield and purity during SWCNT synthesis via the electric arc process , 2007 .
[29] R. Smalley,et al. Electrical and thermal transport properties of magnetically aligned single wall carbon nanotube films , 2000 .
[30] K. Hata,et al. Electrical performance of lightweight CNT-Cu composite wires impacted by surface and internal Cu spatial distribution , 2017, Scientific Reports.
[31] B. P. Wilson,et al. Carbon nanotube-copper composites by electrodeposition on carbon nanotube fibers , 2016 .
[32] Dong Su Lee,et al. Metal nanofibrils embedded in long free-standing carbon nanotube fibers with a high critical current density , 2018, NPG Asia Materials.
[33] Qingwen Li,et al. Ni Nanobuffer Layer Provides Light-Weight CNT/Cu Fibers with Superior Robustness, Conductivity, and Ampacity. , 2018, ACS applied materials & interfaces.
[34] Jun Kim,et al. MWCNT synthesis over Fe-BTC as a catalyst/carbon source via CVD , 2011 .
[35] J. J. Clement,et al. Electromigration in copper conductors , 1995 .
[36] E. S. Meieran,et al. Electromigration in Thin Al Films , 1969 .
[37] Jessica Schulze,et al. The Nature Of The Chemical Bond , 2016 .
[38] Takeo Yamada,et al. One hundred fold increase in current carrying capacity in a carbon nanotube–copper composite , 2013, Nature Communications.
[39] T. Fisher,et al. Parametric study of synthesis conditions in plasma-enhanced CVD of high-quality single-walled carbon nanotubes , 2006 .
[40] Paul S. Ho,et al. Electromigration reliability issues in dual-damascene Cu interconnections , 2002, IEEE Trans. Reliab..
[41] H. B. Huntington,et al. Current-induced marker motion in gold wires☆ , 1961 .
[42] H J Li,et al. Multichannel ballistic transport in multiwall carbon nanotubes. , 2005, Physical review letters.
[43] T. Ebbesen,et al. Capillarity and Wetting of Carbon Nanotubes , 1994, Science.
[44] J. J. Vilatela,et al. Yarn‐Like Carbon Nanotube Fibers , 2010, Advanced materials.
[45] Feng Hou,et al. Continuous Multilayered Carbon Nanotube Yarns , 2010, Advanced materials.
[46] Tomohiro Ohta,et al. WNx diffusion barriers between Si and Cu , 1996 .
[47] D. S. Misra,et al. Electrical transport and electromigration studies on nickel encapsulated carbon nanotubes: possible future interconnects , 2013, Nanotechnology.
[48] K. Koziol,et al. Enhancement of the mechanical properties of directly spun CNT fibers by chemical treatment. , 2011, ACS nano.
[49] Levente Hufnagel,et al. A New Method to Evaluate Habitat Status Based On the Use of Data On Oribatid Mites (Acari: Oribatida) , 2011, HAICTA.
[50] S. Xie,et al. Carbon-nanotube metal-matrix composites prepared by electroless plating , 2000 .
[51] Robert F. Singer,et al. CNT reinforced light metal composites produced by melt stirring and by high pressure die casting , 2010 .
[52] Tu. Electromigration in stressed thin films. , 1992, Physical review. B, Condensed matter.
[53] M. Endo,et al. Cu–MWCNT Composite Films Fabricated by Electrodeposition , 2010 .
[54] M. Meyyappan,et al. Thermal Interface Properties of Cu-filled Vertically Aligned Carbon Nanofiber Arrays , 2004 .
[55] R. Rosenberg,et al. Electromigration Damage in Aluminum Film Conductors , 1970 .
[56] K. Hata,et al. Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics. , 2014, Nanoscale.
[57] E. P. Honig,et al. Electromigration and self-diffusion in ionic melts , 1966 .
[58] K. Méténier,et al. Elastic Modulus of Ordered and Disordered Multiwalled Carbon Nanotubes , 1999 .
[59] A. Esawi,et al. Fabrication and properties of dispersed carbon nanotube–aluminum composites , 2009 .
[60] Chonggui Li,et al. A Novel Melt Processing for Mg Matrix Composites Reinforced by Multiwalled Carbon Nanotubes , 2016 .
[61] K. Hata,et al. Copper/carbon nanotube composites: research trends and outlook , 2018, Royal Society Open Science.
[62] I. Puchades,et al. Carbon nanotube wires with continuous current rating exceeding 20 Amperes , 2017 .
[63] Charles M. Lieber,et al. Probing Electrical Transport in Nanomaterials: Conductivity of Individual Carbon Nanotubes , 1996, Science.
[64] K. Jiang,et al. Carbon nanotube yarns with high tensile strength made by a twisting and shrinking method , 2010, Nanotechnology.
[65] J. Black. Electromigration failure modes in aluminum metallization for semiconductor devices , 1969 .
[66] Emmanuel Flahaut,et al. CARBON NANOTUBE-METAL-OXIDE NANOCOMPOSITES: MICROSTRUCTURE, ELECTRICAL CONDUCTIVITY AND MECHANICAL PROPERTIES , 2000 .
[67] Zhong Lin Wang,et al. Carbon nanotube quantum resistors , 1998, Science.
[68] Sefaattin Tongay,et al. Contents list. , 2016, Nanoscale.
[69] Leiji Zhou,et al. Electrodeposited nickel composites containing carbon nanotubes , 2002 .
[70] Xiaojun Wang,et al. A Novel Method to Fabricate CNT/Mg–6Zn Composites with High Strengthening Efficiency , 2014, Acta Metallurgica Sinica (English Letters).
[71] Henry C. de Groh,et al. Highly Conductive Wire: Cu Carbon Nanotube Composite Ampacity and Metallic CNT Buckypaper Conductivity , 2016 .
[73] M. Nascimento,et al. The nature of the chemical bond , 2008 .
[74] Franz Kreupl,et al. Carbon nanotubes in interconnect applications , 2002 .
[75] S. R. Bakshi,et al. Carbon nanotube reinforced metal matrix composites - a review , 2010 .
[76] Ákos Kukovecz,et al. Optimization of CCVD synthesis conditions for single-wall carbon nanotubes by statistical design of experiments (DoE) , 2005 .
[77] Honglin Luo,et al. Effects of fiber volume fraction, hot pressing parameters and alloying elements on tensile strength of carbon fiber reinforced copper matrix composite prepared by continuous three-step electrodeposition , 2000 .
[78] T. Ono,et al. Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications , 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS).
[79] T. Takagi,et al. Structure–property relationships in thermally-annealed multi-walled carbon nanotubes , 2014 .
[80] J. J. Clement,et al. Electromigration modeling for integrated circuit interconnect reliability analysis , 2001 .
[81] D. Tsentalovich,et al. High‐Ampacity Power Cables of Tightly‐Packed and Aligned Carbon Nanotubes , 2014, 1402.3608.
[82] L. Ladani. The Potential for Metal–Carbon Nanotubes Composites as Interconnects , 2018, Journal of Electronic Materials.
[83] P. Ajayan,et al. Reliability and current carrying capacity of carbon nanotubes , 2001 .
[84] Langer,et al. Quantum transport in a multiwalled carbon nanotube. , 1996, Physical review letters.
[85] Kaustav Banerjee,et al. Are carbon nanotubes the future of VLSI interconnections? , 2006, 2006 43rd ACM/IEEE Design Automation Conference.
[86] Development and performance of the nanoworkbench: A four tip STM for conductivity measurements down to submicrometer scales , 2004, cond-mat/0411127.
[87] P. Avouris,et al. Current saturation and electrical breakdown in multiwalled carbon nanotubes. , 2001, Physical review letters.
[88] Rolf E. Hummel,et al. Electromigration in integrated circuits , 1997 .
[89] Feng Zhou,et al. Electrodeposition and characterization of Ni–Co–carbon nanotubes composite coatings , 2006 .
[90] J. Tan,et al. Metal–nanocarbon contacts , 2014 .
[91] A. Windle,et al. Properties of composites of carbon nanotube fibres , 2009 .
[92] Jinping Xiong,et al. The effects of electrodeposition current density on properties of Ni–CNTs composite coatings , 2008 .
[93] Qingwen Li,et al. Continuous electrodeposition for lightweight, highly conducting and strong carbon nanotube-copper composite fibers. , 2011, Nanoscale.
[94] E. Bekyarova,et al. Effect of atomic interconnects on percolation in single-walled carbon nanotube thin film networks. , 2014, Nano letters.
[95] C. Berger,et al. Room Temperature Ballistic Conduction in Carbon Nanotubes , 2002, cond-mat/0211515.
[96] Pugach Nataliya,et al. International roadmap for devices and systems. Cryogenic electronics and quantum information processing. 2018 Update , 2019 .
[97] P. Chan,et al. Electromigration Studies of Cu/Carbon Nanotube Composite Interconnects Using Blech Structure , 2008, IEEE Electron Device Letters.
[98] N. Zhao,et al. An Approach to Obtaining Homogeneously Dispersed Carbon Nanotubes in Al Powders for Preparing Reinforced Al‐Matrix Composites , 2007 .
[99] H. Lezec,et al. Electrical conductivity of individual carbon nanotubes , 1996, Nature.
[100] B. Sunil,et al. An investigation on the hardness and corrosion behavior of MWCNT/Mg composites and grain refined Mg , 2018 .
[101] M. Endo,et al. Cu/Multiwalled Carbon Nanotube Composite Films Fabricated by Pulse-Reverse Electrodeposition , 2011 .
[102] Yeqing Wang,et al. Multiphysics analysis of lightning strike damage in laminated carbon/glass fiber reinforced polymer matrix composite materials: A review of problem formulation and computational modeling , 2017 .
[103] J. Howell,et al. Diffusion in Solids , 1984, Materials Science Forum.
[104] Cary Y. Yang,et al. Electrical properties of carbon nanotube via interconnects for 30 nm linewidth and beyond , 2016, Microelectron. Reliab..
[105] Dekker,et al. High-field electrical transport in single-wall carbon nanotubes , 1999, Physical review letters.
[106] R. Ishihara,et al. Carbon nanotube vertical interconnects fabricated at temperatures as low as 350 °C , 2014 .
[107] G. Duesberg,et al. Carbon nanotubes for interconnect applications , 2002, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..
[108] A. Asenov,et al. Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study , 2018, IEEE Transactions on Electron Devices.