Hot carrier degradation and ESD in submicron CMOS technologies: how do they interact?
暂无分享,去创建一个
[1] A. Hamada,et al. Time dependence of p-MOSFET hot-carrier degradation measured and interpreted consistently over ten orders of magnitude , 1993 .
[2] G. Groeseneken,et al. Hot-carrier degradation in submicrometre MOSFETs: from uniform injection towards the real operating conditions , 1995 .
[3] C. Duvvury,et al. Dynamic gate coupling of NMOS for efficient output ESD protection , 1992, 30th Annual Proceedings Reliability Physics 1992.
[4] D. B. Krakauer,et al. ESD protection for mixed-voltage I/O using NMOS transistors stacked in a cascode configuration , 1998 .
[5] Sung-Mo Kang,et al. A study of ESD-induced latent damage in CMOS integrated circuits , 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).
[6] P. Habas,et al. Performance and reliability aspects of FOND: a new deep submicron CMOS device concept , 1996 .
[7] C. Duvvury,et al. ESD Protection Reliability in 1μM CMOS Technologies , 1986, 24th International Reliability Physics Symposium.
[8] C. R. Crowell,et al. Temperature dependence of avalanche multiplication in semiconductors , 1966 .
[9] Carlos H. Díaz,et al. Building-in ESD/EOS reliability for sub-halfmicron CMOS processes , 1996 .
[10] R. A. Logan,et al. Ionization Rates of Holes and Electrons in Silicon , 1964 .
[11] H. Grubin. The physics of semiconductor devices , 1979, IEEE Journal of Quantum Electronics.
[12] G. Reimbold,et al. Building in reliability with latch-up, ESD and hot carrier effects on a 0.25 um CMOS technology , 1997, 27th European Solid-State Device Research Conference.
[13] Amitava Chatterjee,et al. Improving the ESD failure threshold of silicided n-MOS output transistors by ensuring uniform current flow , 1992 .
[14] Takashi Hori. Nitrided gate-oxide CMOS technology for improved hot-carrier reliability , 1993 .
[15] G. Groeseneken,et al. Analysis of the charge pumping technique and its application for the evaluation of MOSFET degradation , 1989 .
[16] Chenming Hu,et al. Hot-electron-induced MOSFET degradation—Model, monitor, and improvement , 1985, IEEE Transactions on Electron Devices.
[17] G. Simmons,et al. Snapback Induced Gate Dielectric Breakdown in Graded Junction MOS Structures , 1984, 22nd International Reliability Physics Symposium.
[18] E. Rosenbaum,et al. On the mechanism for interface trap generation in MOS transistors due to channel hot carrier stressing , 2000, IEEE Electron Device Letters.
[19] Kueing-Long Chen. The effects of interconnect process and snapback voltage on the ESD failure threshold of NMOS transistors , 1988 .
[20] C. G. Sodini,et al. Silicon oxynitride gate dielectrics for scaled CMOS , 1992, 1992 International Technical Digest on Electron Devices Meeting.
[21] G. Groeseneken,et al. Consistent model for the hot-carrier degradation in n-channel and p-channel MOSFETs , 1988 .
[22] Amitava Chatterjee,et al. Hot electron reliability and ESD latent damage , 1988 .
[23] A. Amerasekera,et al. ESD-related process effects in mixed-voltage sub-0.5 /spl mu/m technologies , 1998, Electrical Overstress/ Electrostatic Discharge Symposium Proceedings. 1998 (Cat. No.98TH8347).
[24] C. Duvvury,et al. ESD phenomena in graded junction devices , 1989 .
[25] Eiji Takeda,et al. Impact of the gate-drain overlapped device (GOLD) for deep submicrometer VLSI , 1988 .
[26] Cheng T. Wang,et al. Hot carrier design considerations for MOS devices and circuits , 1992 .
[27] G.J. Hu,et al. Design tradeoffs between surface and buried-channel FET's , 1985, IEEE Transactions on Electron Devices.
[28] G. Groeseneken,et al. A reliable approach to charge-pumping measurements in MOS transistors , 1984, IEEE Transactions on Electron Devices.
[29] Guido Groeseneken,et al. Temperature dependence of the channel hot-carrier degradation of n-channel MOSFET's , 1990 .
[30] M. Koyanagi,et al. A novel submicron LDD transistor with inverse-T gate structure , 1986, International Electron Devices Meeting.
[31] Chen Ih-Chin,et al. The effect of channel hot-carrier stressing on gate-oxide integrity in MOSFETs , 1988 .
[32] B. Doyle,et al. Impact of snapback-induced hole injection on gate oxide reliability of N-MOSFETs , 1990, IEEE Electron Device Letters.
[33] C. Duvvury,et al. Achieving uniform nMOS device power distribution for sub-micron ESD reliability , 1992, 1992 International Technical Digest on Electron Devices Meeting.
[34] K. Hess,et al. Reduction of hot electron degradation in metal oxide semiconductor transistors by deuterium processing , 1996 .
[35] Hiroshi Iwai,et al. Electrical characteristics of rapid thermal nitrided-oxide gate n- and p-MOSFET's with less than 1 atom% nitrogen concentration , 1994 .
[36] B.S. Doyle,et al. Reoxidized nitrided oxides (RNO) for latent ESD-resistant MOSFET dielectrics , 1991, IEEE Electron Device Letters.
[37] W. Weber,et al. The Mechanisms of Hot-Carrier Degradation , 1992 .
[38] E. Takeda,et al. An empirical model for device degradation due to hot-carrier injection , 1983, IEEE Electron Device Letters.
[39] A. Ditali,et al. Hot-carrier-induced degradation of gate dielectrics grown in nitrous oxide under accelerated aging , 1992, IEEE Electron Device Letters.
[40] D. Blachier,et al. Building in reliability with latch-up, ESD and hot carrier effects on 0.25 μm CMOS technology , 1998 .
[41] A. J. Walker,et al. A hot-carrier triggered SCR for smart power bus ESD protection , 1995, Proceedings of International Electron Devices Meeting.
[42] T. Hori,et al. Deep-submicrometer large-angle-tilt implanted drain (LATID) technology , 1992 .